Wanfuda Intelligent Manufacturing made a high-profile appearance at the 6th Shenzhen International Semiconductor Exhibition
Publish Time: 2024-12-25
From June 26 to 28, 2024, the 6th Shenzhen International Semiconductor Exhibition was held at the Shenzhen International Convention and Exhibition Center. This exhibition was themed "Core Opportunities, Smart Future", coordinating the semiconductor industry value chain and empowering a better future. Wanfuda Intelligent Manufacturing brought the best Mini LED new display die bonding equipment WFD 8970B to the high-profile appearance, with a position accuracy of XY ±15μm and a UPH of up to 76K/H, leading the new trend of the Mini LED packaging equipment industry and setting off the whole scene.
Wanfuda cordially received purchasing agents and engineers from many companies, and discussed topics such as the performance characteristics, practical application scenarios, market prospects, etc. of new display die bonding equipment, and looks forward to further cooperation.
The WFD8970B high-efficiency die bonding machine is the company's most competitive model. Under the condition of ensuring the accuracy of the client's products and the long-term working accuracy of the equipment, a single device has a high production capacity, leading the Mini LED packaging equipment industry. The equipment's swing arm nozzle has a rotation function, combined with the bottom flying vision algorithm, it can accurately correct the angle of the chip after suction, the equipment adopts a high-speed, high-precision crystal retrieval and die bonding platform, with vacuum leakage crystal suction and XY automatic correction functions, and can identify the R, G, and B polarities of the chip. A single WFD8970B device can complete single-color mixed bonding or RGB three-color die bonding, which is convenient for the client to verify the product and automatic line production, the independently innovative clamping and changing crystal ring mechanism (invention patent has been applied for) can achieve a crystal ring change within 5S, improving the efficiency of mixed bonding.
Wanfuda will continue to uphold the business philosophy of "craftsmanship creates quality, quality wins the market", with R&D and innovation as the core, and is committed to becoming a global leader in semiconductor equipment. With users at the center, we will create more value, go hand in hand with the industry, and move towards a better future together!
