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Die Bonding Machine WFD8966L

Die Bonding Machine WFD8966L

WFD8966L
Backlight 3.4mm 25K or so.
1. It adopts double-arm and four-arm, integrating advanced technologies such as precision mechanical structure system, machine vision, motion control and algorithm.
2. The die bonding head is driven by servo motor and voice coil motor, which can achieve fast response and high-speed and high-precision positioning.
3. It adopts bottom flying vision, and the swing arm structure can rotate 360°, which can accurately correct the angle of the chip.
4. It can identify the polarity of the chip and the chip angle error to improve the die bonding accuracy.
5. The high-speed and high-precision crystal ring platform can automatically switch positions and correct chip angles, and has the function of automatic crystal ring replacement.
6. The high-speed and high-precision die bonding platform is driven by linear motor and has laser height measurement function to improve the die bonding accuracy.
7. The ejector module has XY automatic correction function and accurate position switching.
8. It adopts rotatable upper and lower material platforms to improve the production capacity of the equipment and has good compatibility.
9. It has the function of leaked crystal detection.
10. The software system is easy to operate, highly integrated and intelligent.
Technical Indicators :

Equipment performance

Equipment parameters

Equipment capacity (Full test UPH)

Open PR, bottom flying shot and post-solidification inspection 220K/H (depending on the solid crystal material)

Equipment accuracy

Position accuracy XY

≤±15um

Angular accuracy θ 

≤±1°（depending on the solid crystal material）

Device compatible product size

Length (L) size

Max  380mm

Width (W) size

Max  220mm

Crystal ring size

6 inch

Reading head resolution of crystal retrieval and crystal bonding platform

0.5um

Compatible chip size

2mil*4mil-40mil*40mil(0.05mm*0.1mm-1mm*1mm

Crystal taking pressure of Bond head swing arm

Adjustable 30g-250g

Swing arm nozzle rotation

±180°Any angle die bonding

 

Image recognition system

Resolution

720*540Pixel

Grayscale

256Grayscale

Image recognition accuracy

±2.5um@50mil

 

 Equipment appearance parameters

Dimensions (excluding display, tricolor light & FFU)


 4523mm(L）*2060mm（W）*1800(H)mm

Track height (from ground level)

900mm±30mm

weight

1800kg*3

 

 

Equipment electrical parameters

Voltage/Frequency

220V/50Hz

Rated Power

6.6KW

Using Compressed Air

0.5Mpa(Min)

Gas consumption

60L/Min

Advantage 1
High compatibility and more flexibility: compatible with substrates of various sizes, can be flexibly applied to various anisotropic displays such as arcs, spheres, and wavy lines.

Advantage 2
The packaged chip is smaller and thinner: conventional die bonding equipment can bond 0408 (4mil*8mil) chips, and Wanfuda's die bonding machine can bond 0305 (3mil*5mil) chips and 0204 (2mil*4mil) chips.

Advantage 3
High precision, high production capacity, and high yield: XY position accuracy is high, stability is stronger, product yield is 99.999%, and the equipment measured UPH reaches the industry-leading level.

Advantage 4
Bottom flying technology: capture the chip deflection state and chip polarity identification, and make real-time corrections to the angle of each chip based on the flying visual feedback data.

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