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Die Bonding Machine WFD8971A

Die Bonding Machine WFD8971A

WFD8971A
1.Independent dual working platforms produce in parallel to improve output per unit time.
2.Equipped with high-speed automatic crystal ring change (invention patent), the crystal ring can be changed within 5S.
3.Equipped with a new high-speed and high-precision die bonding platform + high-speed and high-precision transfer head.
4.The equipment feed end is equipped with a 3-layer substrate buffer mechanism.
5.The crystal ring feeding end can load 12 layers of crystal rings.
6.A single machine can realize mixed printing process (mixing 12, 9, 6, 4, 2 times), support random automatic production of non-equidistant or equal-interval mixed printing files, and also support importing mixed printing files from the client.
7.Support parallel or serial connection.
Technical Indicators :

Equipment performance

Equipment parameters

Equipment capacity (Full test UPH)

Open PR, bottom flying shot and post-solidification inspection 75K/H (depending on the solid crystal material)

Equipment accuracy

Position accuracy XY

≤±15um

Angular accuracy θ

≤±1°（depending on the solid crystal material）

Device compatible product size

Length (L) size

Max  380mm

Width (W) size

Max  220mm

Crystal ring size

6 inch

Reading head resolution of crystal retrieval and crystal bonding platform

0.5um

Compatible chip size

2mil*4mil-40mil*40mil(0.05mm*0.1mm-1mm*1mm

Crystal taking pressure of Bond head swing arm

Adjustable 30g—250g

Swing arm nozzle rotation

±180°Any angle die bonding

 

Image recognition system

Resolution

720*540Pixel

Grayscale

256Grayscale

Image recognition accuracy

±2.5um@50mil

 

Equipment appearance parameters

Dimensions (excluding display, tricolor light & FFU)

1480mm(L）*2060mm（W）*1800(H)mm

Track height (from ground level)

900mm±30mm

weight

1800kg*3

 

Equipment electrical parameters

Voltage/Frequency

220V/50Hz

Rated Power

2.2KW

Using Compressed Air

0.5Mpa(Min)

Gas consumption

20L/Min


1.High-speed, high-precision crystal retrieval platform
 
The platform adopts a linear motor drive with special vibration reduction treatment developed independently, and the overall structural design adopts a frame layout. Compared with the screw drive platform or cantilever platform, this innovative crystal retrieval platform has high precision, fast response, low vibration, long service life, and is more stable and reliable. The crystal retrieval platform has the function of XYθ three-axis precision correction. Among them, the XY two-axis direction can achieve high-speed and high-precision positioning, and the actual positioning accuracy is as high as ±1.5μm. It is a highly reliable, more stable and durable crystal retrieval platform.
2.High response, high precision die bonding head

The main innovations are:
The servo motor used by bonding head is independently developed, with reasonable design, high rotation positioning accuracy, stable and reliable, and will not cause problems such as wire wear.
The high-rigidity swing arm with special lightweight design ensures the accuracy of crystal retrieval and solid crystal.
The swing arm nozzle can rotate, and combined with the bottom flying vision, the angle accuracy of the chip can be accurately corrected twice.
3.New high-speed, high-precision die bonding platform

Special vibration reduction simulation calculation and a large number of test processing have greatly reduced the vibration of the die bonding platform under high-speed conditions, shortened the positioning time, and improved the die bonding efficiency while improving the die bonding accuracy and the stability of the equipment's long-term working accuracy. The actual positioning accuracy of the die bonding platform is within ±1.5μm, which can well handle the die bonding of the client's ultra-fine pitch products.
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