Mini LED Backlight Die Bonding Machine

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Features and Technical Indicators
Advantages
After-sales Quality Service

1. It adopts double-arm and four-arm, integrating advanced technologies such as precision mechanical structure system, machine vision, motion control and algorithm.
2. The die bonding head is driven by servo motor and voice coil motor, which can achieve fast response and high-speed and high-precision positioning.
3. It adopts bottom flying vision, and the swing arm structure can rotate 360°, which can accurately correct the angle of the chip.
4. It can identify the polarity of the chip and the chip angle error to improve the die bonding accuracy.
5. The high-speed and high-precision crystal ring platform can automatically switch positions and correct chip angles, and has the function of automatic crystal ring replacement.
6. The high-speed and high-precision die bonding platform is driven by linear motor and has laser height measurement function to improve the die bonding accuracy.
7. The ejector module has XY automatic correction function and accurate position switching.
8. It adopts rotatable upper and lower material platforms to improve the production capacity of the equipment and has good compatibility.
9. It has the function of leaked crystal detection.
10. The software system is easy to operate, highly integrated and intelligent.
Technical Indicators :

Equipment performance
Equipment parameters
Equipment capacity
40K/H (depending on die bonding material)

Equipment accuracy
Chip position accuracy after die bonding XY
±15μm
Chip angle accuracy after die bonding θ
±1°

Device Compatible Product Dimensions
Length (L) size
Max 800mm
Width (W) size
Max 500mm
Advantage 1 High compatibility and more flexibility: compatible with substrates of various sizes, can be flexibly applied to various anisotropic displays such as arcs, spheres, and wavy lines. Advantage 2 The packaged chip is smaller and thinner: conventional die bonding equipment can bond 0408 (4mil*8mil) chips, and Wanfuda's die bonding machine can bond 0305 (3mil*5mil) chips and 0204 (2mil*4mil) chips. Advantage 3 High precision, high production capacity, and high yield: XY position accuracy is high, stability is stronger, product yield is 99.999%, and the equipment measured UPH reaches the industry-leading level. Advantage 4 Bottom flying technology: capture the chip deflection state and chip polarity identification, and make real-time corrections to the angle of each chip based on the flying visual feedback data.

Equipment performance		Equipment parameters
Equipment capacity		40K/H (depending on die bonding material)
Equipment accuracy	Chip position accuracy after die bonding XY	±15μm
Equipment accuracy	Chip angle accuracy after die bonding θ	±1°
Device Compatible Product Dimensions	Length (L) size	Max 800mm
Device Compatible Product Dimensions	Width (W) size	Max 500mm