Features: 1. Develop high-precision controller 2. The first rotating platform + flying shooting function in China 3. Complex motion control algorithm cluster 4.Composite Vision System Specifications: 1. Position accuracy of standard piece/mass production piece after solidification: XY3um/5um 2. Angle accuracy after fixation: θ±0.3° 3. Single machine full test capacity: 1K/H 4. Compatible chip size: (0.16-6mm)*(0.16-6mm) 5. Compatible substrate size: (50mm-100mm)*(50mm-300mm) 6. Can handle 800G/400G/100G optical module mounting
Advantages: 1、(The only one in the market) Adopting high-precision rotating platform to correct the crystal bonding platform, born for stability. 2.High precision and high efficiency: The semiconductor die bonder adopts a sophisticated automated control system, which can accurately position the pad and chip with high precision, greatly improving the success rate of the packaging process. At the same time, the die bonder adopts a modular design, which can quickly complete the packaging process and significantly improve production efficiency. 3. High degree of automation: Multiple modules of the die bonder are automatically controlled, which can complete the entire packaging process without human intervention, greatly improving packaging efficiency. This high degree of automation not only reduces labor costs, but also reduces the risk of human error. 4.Strong applicability: The die bonder uses a variety of packaging technologies, which are suitable for different types of chips and packaging requirements, greatly expanding the scope of application. This makes the die bonder widely used in integrated circuits, optoelectronic devices, sensors and other fields. 5. Good stability: The die bonder has good vibration isolation and stability, ensuring high precision and stability during long-term operation. This is crucial to ensure product quality and efficient operation of the production line. 6.Advanced technology: The new generation of die bonders, such as the AS3601, significantly improves die bonding speed and accuracy by reducing the arm movement distance and optimizing parameter settings. For example, the arm movement distance of the AS3601 is less than 1/3 of that of traditional die bonders, the die bonding speed is increased by more than 60%, and pixel-level chip mixing accuracy can be guaranteed.
