From the afternoon of December 7th to December 8th, the 2024 Gaogong LED Annual Meeting and 15th Anniversary Celebration was grandly held at the Shenzhen Airport Hyatt Hotel. Hundreds of guests from upstream, midstream and downstream companies in the LED industry chain gathered together to celebrate the celebration.China's LED industry has developed rapidly and has become the world's largest LED producer and consumer. China's LED industry covers multiple fields such as LED chips, packaging, applications and related equipment. Wanfuda and Gaogong have witnessed and promoted the vigorous development of China's LED industry.
Wanfuda has a history of nearly 30 years. It is a national high-tech, specialized and innovative small giant enterprise engaged in the research and development, production and sales of intelligent equipment in the consumer electronics, automobile, LED, new energy, semiconductor and other industries. Shenzhen Wanfuda Intelligent Equipment Co., Ltd. is a wholly-owned subsidiary of Wanfuda Precision Co., Ltd., with LED Division and Semiconductor Division. Wanfuda Intelligent Equipment focuses on independent research and development, production and sales of Mini LED die bonders and semiconductor die bonders and other equipment. It has more than 60 intellectual property patents related to die bonders, and has fully independently developed and produced drivers, linear motors, servo motors and other core components of die bonders, as well as independently developed software systems and machine vision processing algorithms and other core technologies.
Wanfuda's Mini LED backlight products mainly include WFD8960B/WFD8966A/WFD8966L series. The position accuracy after solidification is XY: ±15μm, but our actual performance on the client side is ±10μm; the angle accuracy after solidification is θ: ±1°. Currently, under this precision condition, we can achieve compatible substrate sizes W: max500mm, L: 600-1000mm (customizable 1200mm), with good compatibility to meet the diverse needs of customers.
Advantages of Wanfuda die bonding machine: 1. The equipment has a high die bonding position accuracy (the position accuracy after die bonding is within ±10μm); 2. The equipment has a high die bonding angle accuracy θ (the angle accuracy after die bonding is less than ±1°); 3. The single machine has a high effective production capacity, which can reduce manpower and material investment, save labor, and save floor space. 4. The swing arm nozzle can rotate 360°. According to the customer's process requirements, a customized and accurate die bonding algorithm can be developed to handle the die bonding of special-shaped products, such as: FPC pads are distributed in C-shape, circular, herringbone, etc. 5. It can achieve an effect close to no ejector pin print. 6. The equipment supports two methods of automatically detecting chip polarity. With the help of bottom vision, chips whose polarity is difficult to judge on the front can be detected. 7. It has a highly efficient mixed printing process algorithm.
With its strong technical strength and excellent product performance, Wanfuda won the "2023 Gaogong Golden Globe Award for Innovative Products". We would like to thank new and old customers for their support to our company, and also thank Gaogong LED for its great help and affectionate companionship.
